麻豆原创

Khan Mohammad Rabbi journeyed nearly 9,000 miles from Barguna, Bangladesh, to pursue his doctorate in mechanical engineering at 麻豆原创 after earning his bachelor鈥檚 degree from the Bangladesh University of Engineering and Technology. As an international student, the transition was challenging, but support from his family and 麻豆原创鈥檚 strong global reputation motivated him to succeed.

During his time at 麻豆原创, Rabbi focused on designing and developing liquid cooling systems for next-generation devices and machines. His research explored both active and passive cooling technologies, including innovative 3D flexible cooling solutions with applications in data centers, electric vehicles, and space systems. 鈥淲hat always amazes me at 麻豆原创 鈥� is the collaborative nature of research,鈥� he says, noting partnerships with industry leaders like NASA and Lockheed Martin.

Rabbi鈥檚 work gained recognition at the 2020 麻豆原创 Three Minute Thesis Competition, where he was named runner-up. The experience allowed him to communicate complex research to a broader audience, and he credits his wife for helping him refine his presentation from a non-technical perspective.

Throughout his doctoral studies, Rabbi received numerous awards, including the Doctoral Research Support Award, Best Poster Award at the IEEE iTherm Conference, and the ORC Doctoral Fellowship. His dedication to research and innovation positioned him for a successful transition into industry.

After graduating in 2022, Rabbi began his career as a semiconductor research engineer at Intel, where he continues to advance thermal management technologies for cutting-edge systems.

• Runner-up, 2020 麻豆原创 3MT Competition
• Doctoral Research Support Award (2020)
• Best Poster Award, IEEE iTherm Conference (2020)
• Second Place, Technical Elevator Pitch Contest (2020)
• Best MAE Poster Award (2019)
• 麻豆原创 Global CPT Tuition Scholarship (2020)
• FLEARN Graduate Research Mentor Scholarship (2018鈥�2020)
• ORC Doctoral Fellowship (2017)

Rabbi continues to apply his expertise in thermal engineering to develop innovative cooling solutions that support the future of advanced electronics and systems.